Assembly Engineer 封装工程师

岗位职责

Summary:MonitoranddevelopsupplierqualitywithbestTQRDC(Technology,Quality,Response,DeliveryandCost)performance.监控和提高封装厂在技术，质量，反馈，交期以及成本方面的表现RESPONSIBILITIES:1.Handleassemblyqualityissue,verifytherootcauseandmakesurethecorrectiveactionscanbeimplementedeffectivelyandtimelytopreventrecurrence.处理封装质量事故，查找原因并协助封装供应商制定和实施有效改进措施，预防同类事故再次发生。2.Conductregularauditandhavethequarterlyperformancerating,discussquality/technicalissueswithsupplierstosupportthemoncontinuousimprovementandprovidereliableproduct.完成定期对封装供应商的审查和季度的评分，并与其探讨以提升质量及技术，协助他们制定长期有效的改进措施以提供高质量产品。3.Weeklymonitorandanalyzetheassemblyyield,defectmode,SPCtoassureongoingqualitysystemcapability,anddailychecktheassemblyWIPtoensuretheshortassemblycycletimeandontimedelivery.每周监控和分析封装良率、废品模式、SPC等以确保可靠的产品质量，每天查看封装供应商在线产品的状况以缩短产品封装周期，保证准时交货。4.Conducttheriskassessmentandhavethedispositionforwaferincomingissueatsupplierandonholdlotwithassemblyissueattestfloor.完成对风险产品的评估，处理在封装供应商处芯片来料问题及测试线因封装问题而被扣留的产品。5.Generateandevaluatesupplierqualityreports,establishappropriatebaseline,determinecontinuousimprovementopportunities完成对封装供应商的评估报告以及制定各种封装特殊要求，提出需持续改进的地方。6.CoordinateswithFAengineerstoindentifytheassemblyfailures,addressestherootcauseandgetthecorrectiveactionswithassemblers.协助FA工程师分析封装失效废品，找到失效原因并与封装供应商一起提出解决措施。7.Coordinatesthequalificationofnewsupplier,materials,package,assemblyprocesses.协助对各种新封装供应商、